Sensor Magnetic Assemblies

Precision magnetic circuits for Hall effect and MR sensors, engineered for stable flux output, tight positional tolerance, and repeatable high-volume assembly performance.

Target Buyer:Electronics & Instrumentation Engineers

Capability Highlights

High and repeatable flux density for stable switching thresholds
Tight dimensional control (down to ±0.05mm on critical interfaces)
Multi-pole and custom magnetization direction options
Overmolding and insert options for harsh-environment protection
Batch-level magnetic mapping for first-article and pilot validation

Typical Applications

Automotive speed sensors
Industrial encoders
Medical positioning
Linear actuator end-position sensing
Consumer electronics lid/open-close detection

Engineering Focus

Flux distribution repeatability across lots
Temperature stability under real duty-cycle thermal conditions
Air gap and mechanical stack-up management
Magnetic axis alignment with sensing element geometry
Assembly method impact on long-term drift behavior

Key Evaluation Matrix

Metric	Typical Range	Why It Matters
Tolerance	±0.05mm	Ensures reliable sensor triggering
Flux Consistency (Batch Cpk)	Project-defined, typically Cpk >= 1.33	Supports stable comparator thresholds and reduces false trigger risk
Thermal Flux Drift	<5% across validated temperature window	Prevents signal margin collapse when temperature profile changes

RFQ Checklist

Sensor IC or probe spec sheet with trigger window
Operating temperature range and excursion limits
Target air gap and mounting tolerance stack
Magnetic output acceptance method (gauss meter distance/fixture)
Expected annual volume and pilot build timing

Risk Controls

Flux loss over time: Pre-aging and thermal stabilization with lot-level retention checks
Sensor-to-magnet misalignment during assembly: Datum-based fixture strategy and first-article alignment records
Output variance between pilot and production: Golden sample boundaries plus pilot-to-mass process lock checklist

Pre-PO Validation Path

Before releasing tooling or annual-volume orders, align your supplier review on one measurable acceptance baseline, one practical pilot test method, and one signed risk-closure record. This removes ambiguity during engineering handoff and prevents quote-stage assumptions from leaking into production.

Lock acceptance criteria around Tolerance and define who signs off at sample and pilot stages.
Run pilot checks on Flux distribution repeatability across lots + Temperature stability under real duty-cycle thermal conditions under your real duty-cycle conditions.
Include Sensor IC or probe spec sheet with trigger window, Operating temperature range and excursion limits, Target air gap and mounting tolerance stack in the first RFQ package to reduce back-and-forth loops.
Capture closure evidence for Flux loss over time before approving mass-production release.